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Industry Standards
  UL 94V-0 flammability rating  
  IPC 600, 6011, 6012 Class 2 & 3  
  ISO 9001-2000  
  RoHS Compliant  
 
Materials
  Laminate & Prepreg per IPC4101 & IPC-CF-150E  
  FR4 (standard & 170 C Tg)  
  Rogers, Nelco, Isola, Taconic, Polyimide  
  Rigid-Flex PCB, Metal PCB, Teflon PCB  
 
Construction
  Max number of layers: 10 [24+]  
  Min finished board thickness: 0.020" [0.008"]  
  Max finished board thickness: 0.125" [0.300"]  
  Minimum core thickness: 0.005" [0.002"]  
  Minimum dielectric thickness: 0.005" [0.002"]  
  Maximum aspect ratio: 10:1 [30:1]  
  Thickness tolerance: 10% [7%]  
  Layer registration tolerance: 0.005" [0.003"]  
  Maximum Warpage: 0.007" [0.006"]  
  Min conductor to edge space: 0.015" [0.008"]  
 
Fabrication
  Overall dimension tolerance : 0.008" [0.005"]  
  Cutout tolerance: 0.008" [0.005"]  
  Minimum inside radius: 0.015"  
  Route-and retain (tab routing)  
  V-Scoring (single and double-edged)  
  Countersink & counter bore  
  Beveling & edge milling  
  Finger & slot routing  
  Jump scoring  
 
Line & Space
  Minimum outer layer trace width: 0.005" [0.003"]  
  Minimum outer layer space: 0.005" [0.003"]  
  Minimum inner layer trace width: 0.005" [0.003"]  
  Minimum inner layer space: 0.005" [0.003"]  
  Finished trace width within 20% of artwork  
 
Impedence
  Tolerance (25-100 ohms): 10% [5%]  
  Controlled impedance dielectric  
  Impedance-controlled lines  
  Differential/single-ended impedence controll  
 
Drilling
  Minimum hole size: 0.005" [0.004"]  
  Min pad size over hole: 0.012" [0.008"]  
  Hole size tolerance: 0.003" [0.002"]  
  Hole location tolerance: +/- 0.003"  
  Blind/buried vias, tented vias, via plugs  
  Via-In-Pad (BGA/MBGA)  
  Countersinks, plated & non-plated slots  
 
Copper Plating
  Minimum base copper: 1/2 oz. [1/4 oz.]  
  Maximum base copper: 2 oz. [10 oz.]  
  Minimum copper foil: 1/2 oz. [1/8 oz.]  
  Maximum copper foil: 2 oz. [10 oz.]  
  Hole plating thickness: 0.0007" - 0.005"  
 
Surface Finishes
  HASL (Hot Air Solder Leveled)  
  HAL (Lead-Free Solder)  
  ENIG (Electroless Nickel, Immersion Gold)  
  Hard Gold (full body or selective)  
  Soft Gold (full body or selective)  
  Immersion Silver / Nickel / Tin / Palladium  
  Gold plated fingers/edge connectors  
  OSP (Organic Solderability Preservative)  
  Combination Finishes  
 
Solder Mask / Silkscreen
  Liquid photoimageable solder mask  
  Solder mask colors available: full spectrum  
  Solder mask registration tolerance: +/-0.005"  
  Minimum solder mask web: 0.002"  
  Solder mask nominal thickness: 0.0004"  
  Conductive and non-conductive via fill  
  Silkscreen min 0.007" line required  
  Silkscreen colors available: full spectrum  
 
Electrical Testing
  Continuity 10-50 ohm (50 ohm std.)  
  Isolation 10-100 Mohm (10 Mohm std.)  
  Voltage 10-250V (100 V std.)  
  Net list comparison  
  Flying probe testing  
  HiPot testing up to 1200 volts  
 
Turn Times
  Standard turn for 2/4 layer board: 7 Days  
  Expedite turn for 2/4 layer board: 5 Days  
  Standard turn for 6+ layer board: 10 Days  
  Expedite turn for 6+ layer board: 7 Days